Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

A new technical paper titled “Leveraging ASIC AI Chips for Homomorphic Encryption” was published by researchers at Georgia Tech, MIT, Google and Cornell University. “Cloud-based services are making ...

Innolux gearing up for FOPLP boom Innolux's transformation journey: from display panel to advanced semiconductor packaging Innolux to unveil industry-first color conversion MicroLED display at ...

After almost three decades of development, the Southern Taiwan Science Park (STSP) has become a global hub of semiconductor production. Save my User ID and Password Some subscribers prefer to save ...

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...