High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for advanced packaging and ...

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market ...

The funds will enable new technologies to be validated and transitioned at scale.

Capital Region (WRGB) — Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing in Saratoga County.