Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, ...

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive ...

Wafer CSP s or wafer-scale/chip-scale packages (WS-CSP) have been in development for more than five years. In 2000, approximately 260 million wafer CSP die will be ...

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...