KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...
CEO Michael Plisinski highlighted a record quarterly revenue of $264 million for Q4 2024, attributed to strong AI packaging demand and growth in the specialty and advanced packaging markets. He ...
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KLAC Q1 Earnings Call: AI Demand and Advanced Packaging Drive Outperformance Amid Trade Uncertainty
Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2025 results , with sales up 29.8% year on year to $3.06 billion. The company expects next quarter’s revenue to ...
Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...
(Reuters) -Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer chip equipment supplier said on Monday. The transaction makes it the largest ...
FREMONT, Calif.--(BUSINESS WIRE)--#AI--Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, today ...
As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The ...
X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected ...
Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
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