Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
EDN9d
Nvidia, TSMC, and advanced packaging realignment in 2025
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
Semiconductor Engineering6d
Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology
High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
Government finalizes $1 billion in CHIPS Act funding for Tempe facility
More than $1 billion worth of federal government funding is coming to Tempe for cutting-edge projects to advance the computer ...
Manufacturing12d
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
Electronic Design12d
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.