Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
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Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...
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Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Cyclical Worries Open A Window Of Opportunity With Shin-Etsu Chemical
Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...
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GlobalFoundries to build new chip packaging center
GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.
ASU Research Park named one of nation's 3 'flagship' R&D facilities for microchips
The ASU Research Park is one of three designated facilities nationwide and will focus on research and testing of new ...
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Advanced Semiconductor Packaging Market Is Going To Boom In New Research Report 2025 -2032
1. Market Overview Advanced semiconductor packaging integrates cutting-edge technologies to improve chip functionality, density, and thermal management. Unlike traditional packaging, which ...