GlobalFoundries to build new chip packaging center
GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.
GlobalFoundries to establish new center for advanced packaging and testing
Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next 10-plus years. These efforts are expected to create approximately 100 new full-time GF jobs in New York over the next five years.
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
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GlobalFoundries Stock Edges Up Pre-Market As It Expands Packaging Capacity With New Facility: Retail Remains Divided
Shares of GlobalFoundries Inc. (GFS) gained more than 1% in pre-market trade on Friday as the company announced an expansion ...
Manufacturing4h
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
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YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
This system provides superior quality and total cost of ownership for our customers, particularly for the manufacturing of advanced 2.5D and 3D packaging solutions for the semiconductor industry ...