GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next 10-plus years. These efforts are expected to create approximately 100 new full-time GF jobs in New York over the next five years.
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
The funds will enable new technologies to be validated and transitioned at scale.
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are ...
GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...
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